Assessment of thermoelectric module with nanofluid heat exchanger

Results show that there exist a lag-time in thermal response between the module and the heat exchanger. This is attributed to thermal contact resistance between the two components. A comparison of nanofluid and deionized water data reveals that the temperature difference between the hot- and cold-side, ΔT = Th − Tc ≈ 0, is almost zero for nanofluid whereas ΔT > 0 for water. When ΔT ≈ 0, the contribution of Fourier effect to the overall heating is approximately zero hence enhancing the module cooling capacity. Experimental evidence further shows that temperature gradient across the thermal paste that bonds the chip and heat exchanger is much lower for the nanofluid than for deionized water. Low temperature gradient results in low resistance to the flow of heat across the thermal paste. The average thermal contact resistance, R = ΔT/Q, is 0.18 and 0.12 °C/W, respectively for the deionized water and nanofluid. For the range of optimum current, 1.2 ⩽ current ⩽ 4.1 A, considered in this study, the COP ranges between 1.96 and 0.68.