Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6682331 | Applied Energy | 2016 | 16 Pages |
Abstract
Ground source heat pumps (GSHPs) are an environmentally friendly alternative to conventional heating and cooling systems because of their high efficiency and low greenhouse gas emissions. The ground acts as a heat sink/source for the excess/required heat inside a building for cooling and heating modes, respectively. However, imbalance in heating and cooling needs can change ground temperature over the operating duration. This increase/decrease in ground temperature lowers system efficiency and causes the ground to foul-failing to accept or provide more heat. In order to ensure that GSHPs can operate to their designed conditions, thermal modelling is required to simulate the ground temperature during system operation. In addition, the borehole field layout can have a major impact on ground temperature. In this study, four buildings were studied-a hospital, fast-food restaurant, residence, and school, each with varying borehole configurations. Boreholes were modelled in a soil volume using finite-element methods and heating and cooling fluxes were applied to the borehole walls to simulate the GSHP operation. 20Â years of operation were modelled for each building for 2Â ÃÂ 2, 4Â ÃÂ 4, and 2Â ÃÂ 8 borehole configurations. Results indicate that the borehole separation distance of 6Â m, recommended by ASHRAE, is not always sufficient to prevent borehole thermal interactions. Benefits of using a 2Â ÃÂ 8 configuration as opposed to a 4Â ÃÂ 4 configuration, which can be observed because of the larger perimeter it provides for heat to dissipate to surrounding soil were quantified. This study indicates that it is important to carefully consider ground temperature during the operation of a GSHP. Borehole separation distances, layout, and hybridization should be studied to alleviate ground fouling problems.
Related Topics
Physical Sciences and Engineering
Energy
Energy Engineering and Power Technology
Authors
Ying Lam E. Law, Seth B. Dworkin,