Analytical study of the dynamic behavior of a voided adhesively bonded lap joint under axial harmonic load

In the present work an analytical model based on the improved shear-lag model was established for a bonded lap joint under a harmonic axial force, where a void is implanted in the overlap. The adherents were considered to be made from Aluminum while the adhesive was an epoxy with viscoelastic behavior. The model was validated using a 2D finite element model through ABAQUS software and the resonant axial frequencies where accurately predicted. The effect of the central void's size as well as the void's position and the loss factor of the adhesive on the modal behavior and also on the adhesive shear stress distribution and the level of the maximum adhesive stress was investigated.