| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6979209 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2014 | 7 Pages |
Abstract
- He and He/O2 cold gas plasma (CAP) were used to surface modify UHMWPE.
- CAP reduced the UHMWPE asperity density and their height through plasma etching.
- CAP improved hydrophilicity of UHMWPE.
- Adhesion between a borosilicate sphere and CAP treated UHMWPE were measured.
- CAP modified UHMWPE had higher adhesion forces.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Emily Callard Preedy, Emmanuel Brousseau, Sam L. Evans, Stefano Perni, Polina Prokopovich,