| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6979397 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2014 | 7 Pages |
Abstract
- A polymer-polymer complexes for copper electroless deposition approach is developed.
- Polymer mixtures PEGÂ +Â EC and PEGÂ +Â PDMAPS are tested.
- Improved adhesion in the presence of the polymer-polymer complexes was achieved.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
M. Radoeva, M. Monev, I.T. Ivanov, G.S. Georgiev, B. Radoev,