| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6998415 | Journal of Colloid and Interface Science | 2014 | 9 Pages |
Abstract
- Cu and Ag Nps incorporated in situ in phenolic resin beads during polymerization.
- Uniform and significant metal loading in the carbonized and activated beads.
- Partial replacement of expensive Ag Nps with inexpensive Cu Nps.
- Prepared materials applied as an effective antibacterial agent.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Prateek Khare, Ashutosh Sharma, Nishith Verma,