Article ID Journal Published Year Pages File Type
700806 Diamond and Related Materials 2011 9 Pages PDF
Abstract

In order to increase the initial nucleation density for the growth of boron-doped diamond on platinum wires, we employed the novel nucleation process (NNP) originally developed by Rotter et al. [1]. This pretreatment method involves (i) the initial formation of a thin carbon layer over the substrate followed by (ii) ultrasonic seeding of this “soft” carbon layer with nanoscale particles of diamond. This two-step pretreatment is followed by the deposition of boron-doped diamond by microwave plasma-assisted CVD. Both the diamond seed particles and sites on the carbon layer itself function as the initial nucleation zones for diamond growth from an H2-rich source gas mixture. We report herein on the characterization of the pre-growth carbon layer formed on Pt as well as boron-doped films grown for 2, 4 and 6 h post NNP pretreatment. Results from scanning electron microscopy, Raman spectroscopy and electrochemical studies are reported. The NNP method increases the initial nucleation density on Pt and leads to the formation of a continuous diamond film in a shorter deposition time than is typical for wires pretreated by conventional ultrasonic seeding. The results indicate that the pre-growth layer itself consists of nanoscopic domains of diamond and functions well to enhance the initial nucleation of diamond without any diamond powder seeding.

Research Highlights► Nanocrystalline can readily nucleate on Pt. ► The pre-growth carbon layer (NNP layer) formed on Pt consists of nanocrystals of diamond mixed with amorphous sp2 carbon. ► The pre-growth carbon layer functions to enhance the initial nucleation of microcrystalline diamond. ► The NNP treatment increases the initial nucleation density. ► This leads to the formation of a continuous diamond film in a shorter deposition time than is typical for wires pretreated by conventional ultrasonic seeding.

Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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