Study of an on-line precision microgroove generating process on silicon wafer using a developed ultra-thin diamond wheel-tool

► A wheel-blank is made of diamond grain of 0-2 µm via a designed micro co-deposition. ► With abrasive content of 8 g/l, a suitable chip-pocket of 2-3 µm can be generated. ► The wheel-blank is thinned down to a thickness of 15 µm by w-EDD. ► Grinding depth of 0.5 µm can achieve a ductile grinding on silicon wafer. ► The width, depth and roughness of grooving are 15-, 9- and 0.087-µm, respectively.