Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
703062 | Diamond and Related Materials | 2010 | 8 Pages |
Abstract
A new set-up for polishing of CVD diamond films on a high speed rotating titanium plate has been developed. The influence of polishing pressure on the surface character, roughness and material removal rate have been studied by using scanning electron microscopy, stylus profilometer, X-ray photoelectron spectroscopy and Raman spectroscopy before and after polishing, respectively. The results showed that the material removal mechanism is mainly the chemical reaction between carbon and titanium and the diffusion of carbon atoms into the polishing plate during the super-high speed polishing. The current method exhibits a high polishing rate in only a few hours. This preliminary result reveals a great potential for commercializing.
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Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
S.T. Huang, L. Zhou, L.F. Xu, K.R. Jiao,