Article ID Journal Published Year Pages File Type
703062 Diamond and Related Materials 2010 8 Pages PDF
Abstract

A new set-up for polishing of CVD diamond films on a high speed rotating titanium plate has been developed. The influence of polishing pressure on the surface character, roughness and material removal rate have been studied by using scanning electron microscopy, stylus profilometer, X-ray photoelectron spectroscopy and Raman spectroscopy before and after polishing, respectively. The results showed that the material removal mechanism is mainly the chemical reaction between carbon and titanium and the diffusion of carbon atoms into the polishing plate during the super-high speed polishing. The current method exhibits a high polishing rate in only a few hours. This preliminary result reveals a great potential for commercializing.

Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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