Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
703670 | Diamond and Related Materials | 2007 | 4 Pages |
Abstract
To fabricate electrical contacts on top of c-BN films, Au films were deposited through a mask by Pulsed Laser Ablation (PLD) and evaporation to allow a comparison of the mechanical stability as well as conductive behavior for both methods. Though in all cases a thin intermediate Cr layer was added to improve adhesion, it turned out that evaporated films had to be ion bombarded additionally at room temperature with 300Â keV Ar+ ions to guarantee mechanical stability whereas the PLD films were stable without further bombardment. The resulting I-V characteristics for both types of contacts exhibit the required ohmic behavior.
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Engineering
Electrical and Electronic Engineering
Authors
H. Yin, H.-G. Boyen, X.-W. Zhang, P. Ziemann,