Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7046037 | Applied Thermal Engineering | 2018 | 29 Pages |
Abstract
A quick weight saving methodology with trapezoidal base heat sink applicable for electronic cooling application is studied analytically, numerically, and experimentally. The conventional heat sink with rectangular base can be modified into trapezoidal base for material saving. A differential equation capable of describing the temperature distribution of the trapezoidal base is derived and its closed-form analytic expression is derived. It is found that three parameters rA (ratio of effective surface area to the base area), rd (ratio of chip lateral length to the base length) and h+ (modified convection heat transfer coefficient) play pivotal roles in balancing the material saving and the performance loss. When rdâ¯=â¯0.1, the material saving for rtâ¯=â¯0.6 is about 18%; while the corresponding performance loss is 2.93%. When rdâ¯=â¯0.2, the material saving for rtâ¯=â¯0.6 is about 16%; while the corresponding performance loss is 2.47%. The analytical results are verified with experiments with good agreement.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Hong-Long Chen, Chi-Chuan Wang,