Thermal performance of a PCB embedded pulsating heat pipe for power electronics applications

Low voltage power electronics applications (<1.2 kV) are pushing the design envelope towards increased functionality, better reliability, low profile and reduced cost. One packaging method to enable these constraints is the integration of active power electronic devices into the printed circuit board improving electrical and thermal performance. This development requires a reliable passive thermal management solution to mitigate hot spots due to the increased heat flux density. To this end, a 44 channel open looped pulsating heat pipe (OL-PHP) is experimentally investigated for two independent dielectric working fluids - NovecTM 649 and NovecTM 774 - due to their lower pressure operation and low global warming potential compared to traditional two-phase coolants. The OL-PHP is investigated in vertical (90°) orientation with fill ratios ranging from 0.30 to 0.70. The results highlight the steady state operating conditions for each working fluid with instantaneous plots of pressure, temperature, and thermal resistance; the minimum potential bulk thermal resistance for each fill ratio and the effective thermal conductivity achievable for the OL-PHP.