Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7048696 | Applied Thermal Engineering | 2016 | 22 Pages |
Abstract
In this investigation, thermal transient measurements and analyses are used to study the thermal performance of a cascoded GaN power device. The method is based on the thermal characterization of the on-resistance (Ron) of the device and the synchronized current-voltage characteristics under continuous operation. The changes in Ron with temperature (25â°C-180â°C) are measured, statistically studied, and correlations investigated. The proposed method for estimating transient thermal impedance has the following characteristics: (1) it is robust and reproducible; (2) it yields a heating curve to prevent over-heating for the device under test (DUT); (3) it provides in-situ current-voltage characterization; (4) it includes a transient offset correction for initial transient electrical disturbances (such as current collapse); (5) it optimizes a compact thermal model; (6) it is sensitive to package structure and design variables. This monitoring of thermal impedance variation provides a simple and fast non-destructive method for analyzing power switching devices during thermal testing. Satisfactory experimental results confirm the feasibility of in-situ current-voltage characterization and the real power varies with the thermal impedance.
Related Topics
Physical Sciences and Engineering
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Authors
Szu-Hao Chen, Po-Chien Chou, Stone Cheng,