Article ID Journal Published Year Pages File Type
7048951 Applied Thermal Engineering 2015 7 Pages PDF
Abstract
Pushing the critical heat flux (CHF) limit in boiling has been a century-old challenge. Overcoming this challenge can greatly benefit advancements of myriad devices in which a large quantity of heat must be removed from a small surface. The occurrence of CHF is accompanied by the formation of significant vapor adjacent to the heated surface, such that liquid cannot rewet the surface. Here, a new concept is implemented to ensure that liquid always displaces the vapor near the heated surface. In the new approach, flow is constrained within a hydrophilic microstructure by a hydrophobic vapor-permeable nanostructure. A bubble bounded between the two structures is pulled away from the hydrophilic heated structure and discharged from the flow, thus leading to a fundamental change in CHF dynamics. The performance of a device based on this principle exceeded that of prior studies, with some metrics exhibiting an order of magnitude improvement.
Related Topics
Physical Sciences and Engineering Chemical Engineering Fluid Flow and Transfer Processes
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