Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7049971 | Applied Thermal Engineering | 2013 | 7 Pages |
Abstract
The dynamic changes of the vapour concentration during Vapour Phase Soldering (VPS) process was investigated by a board level modelling approach of vapour condensation. This model is based on a process (machine) level model which calculates the vapour and temperature space in the VPS tank. The board level condensation model is embedded into the process level model and runs as a co-simulation. The condensation model applies combined transport mechanisms including heat transport by heat conduction; mass transport by phase change during the condensation of the Galden liquid; and energy transport caused by mass transport. The model uses a special dew point calculation which was developed for Galden liquid by experiments. The model can describe the temperature change of soldered assembly, and the vapour consumption around the assembly. This way the effect of the soldered assembly on the vapour space can be investigated. It was also shown that the heat conduction of the vapour space and the immersion speed of the assembly cannot be neglected.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Balázs Illés, Attila Géczy,