Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7050666 | Applied Thermal Engineering | 2013 | 9 Pages |
Abstract
New materials are needed in the development of advanced, compact and light weight thermal systems to satisfy new demand from emerging technologies. High porosity metal foams are excellent for high heat dissipation. They are employed in aerospace application mainly, but there use has been widened to include heat removal from high density microelectronics circuits. Other important applications have been found taking advantages of the thermal properties of the metal foam. These applications include compact heat exchangers for airborne equipment regenerative and dissipative air cooled condenser towers, and compact heat sinks for power electronic. The low relative density, open porosity and high thermal conductivity of the cell edges, as well as the large accessible surface area per unit volume, and the ability to mix the cooling fluid, all make metal foam heat exchangers efficient, compact and light weight. On the basis of Ansys software
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Authors
A.M. Mahalle, B.N. Jajoo,