Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7060733 | International Journal of Thermal Sciences | 2018 | 12 Pages |
Abstract
To determine its ability to predict the maximum operating temperature of a set of buried chips, that practical solution is compared to its corresponding numerical model representing all the layers of realistic electronic board. Moreover the need to consider each PWB's layer is debated with the aim to faster the chip temperature evaluation. Thus a layer-selection method is investigated to find the best balance between accuracy and computation time. By using such optimised approach the computation time can be shortened by a factor of 600, compared to a detailed numerical analysis, while keeping a similar accuracy. Further, it could be a practical way to proceed to a smart simplification of the numerical model of PWB substrate for actual equipment.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Brice RogiƩ, Eric Monier-Vinard, Minh-Nhat Nguyen, Valentin Bissuel, Najib Laraqi,