Article ID Journal Published Year Pages File Type
7150958 Solid-State Electronics 2016 5 Pages PDF
Abstract
Difference thermal conductivity and resistivity resulted in covered SiNx crack on Cu line, voids in Al line. Power-law dependency of ΔVt indicates defect states creation.353
Keywords
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
Preview
Effects of various gate materials on electrical degradation of a-Si:H TFT in industrial display application
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