Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
749319 | Solid-State Electronics | 2008 | 6 Pages |
Abstract
The high-temperature operation of a GaN MOSFET is reported. The MOSFETs were operated up to 250 °C, best reported to date. The MOSFETs showed good dc characteristics with field-effect mobilities of 138 cm2/Vs and 133 cm2/Vs at room temperature and 250 °C, respectively. The field-effect mobility, threshold voltage, and sub-threshold slope did not changed significantly up to 250 °C. Also, we compared the activation annealing condition for n+ layer fabrication. A high-temperature annealing condition of 1300 °C led to a low contact resistance, but caused slight degradation of the field-effect mobility compared with the 1100 °C annealing condition.
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Authors
Takehiko Nomura, Hiroshi Kambayashi, Yuki Niiyama, Shinya Otomo, Seikoh Yoshida,