| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7704733 | Bioelectrochemistry | 2018 | 20 Pages |
Abstract
The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15Â V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed.
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Pan Yi, Kui Xiao, Chaofang Dong, Shiwen Zou, Xiaogang Li,