Article ID Journal Published Year Pages File Type
773492 European Journal of Mechanics - A/Solids 2015 13 Pages PDF
Abstract

•Novel higher-order layerwise piezoelectric sandwich shell laminate theory.•Prediction of interlaminar shear stresses at discrete layer interfaces.•Low number of discrete layers required for capturing through-thickness response.•Active and sensory configurations with piezoelectric layers or patches studied.•Curvature and thickness increase peeling stress at piezoelectric transducers.

Coupled higher-order layerwise piezoelectric laminate mechanics are presented, applicable to shallow cylindrical composite and sandwich shells subjected to static mechanical loads and/or electric voltages. The current formulation enables efficient prediction of (i) global electromechanical response, (ii) local through-thickness distribution of electromechanical variables and (iii) interlaminar shear stress at the interface between adjacent material layers. Using the developed mechanics, the effects of curvature, thickness and ply angle on the global and local through-thickness response of sandwich composite shells are studied.

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Related Topics
Physical Sciences and Engineering Engineering Mechanical Engineering
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