Blistering behavior and deuterium retention in tungsten vanadium alloys exposed to deuterium plasma in the linear plasma device STEP

The behavior of tungsten-vanadium (W-V) alloys fabricated by powder metallurgy as a plasma facing material has been studied. W-V alloys with different vanadium concentrations (5 and 10 wt %) manufactured by hot pressing (HP) were exposed to deuterium plasma (flux ∼4.6 × 1021 m−2s−1, fluence ∼5.6 × 1025 m−2, ion energy ∼60 eV, target temperature ∼450 K) in the linear plasma device STEP at Beihang University. Three typical grains are observed on HP sintered W-V alloys and exhibit a significant effect on its performance under deuterium plasma irradiation. Surface blistering only occurs at W-enriched grains and is significantly mitigated in W-V alloys, especially in W-10 V, blistering is completely suppressed. On the other hand, deuterium retention dramatically increases in the W-V alloys due to vanadium addition. The deuterium retention in W-5 wt. % V is about 6.2 times more than that in rolled pure W, and this factor further increases to 6.9 when the V concentration rises to 10 wt %. We ascribe these phenomena to the changes of microstructures and components caused by vanadium addition.