| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8030414 | Surface and Coatings Technology | 2013 | 5 Pages |
Abstract
⺠Spatial distribution of adhesion strength is evaluated with a resolution of 300 nm. ⺠Adhesion strength significantly scatters ranging from half to double of the average. ⺠Copper grain structure has a significant effect on adhesion strength, which is weaker with grain boundary junctions.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Shoji Kamiya, Nobuyuki Shishido, Shinsuke Watanabe, Hisashi Sato, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa,