Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8035148 | Thin Solid Films | 2014 | 4 Pages |
Abstract
Low-temperature formation (~ 150 °C) of Ge films on insulator is investigated for realization of advanced flexible devices. We propose utilization of Sn as catalyst to enhance the crystallization at low-temperatures. By annealing (150-200 °C) of a-Ge/Sn stacked structures formed on insulators, the composition distributions of Ge/Sn layers are inverted, and Sn/poly-Ge stacked structures are obtained. The results demonstrate that the crystallization occurs at 150 °C, which is slightly below the eutectic temperatures. This Sn-induced crystallization technique is useful to obtain poly-Ge on low-cost flexible substrates (softening temperature: ~ 200 °C).
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
A. Ooato, T. Suzuki, J.-H. Park, M. Miyao, T. Sadoh,