Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9778036 | Journal of Non-Crystalline Solids | 2005 | 5 Pages |
Abstract
In this work, the degradation of electrical performances of Double-Gate MOSFET due to the fringing induced barrier lowering (FIBL) effect induced by high-κ gate dielectrics is investigated using a two-dimensional quantum-mechanical simulation code. Our numerical results show that all electrical parameters, such as the threshold voltage (VT), device immunity to short-channel effects, off-state current (Ioff), and subthreshold slope (S) are degraded when κ increases (3.9 < κ < 100). This degradation is both function of the channel length and the gate dielectric stack composition (number of layers, κ value). In particular, it is shown that the introduction of a thin (<1 nm thick) interfacial oxide layer can reduce or even completely suppress the FIBL for a given equivalent oxide thickness of the gate dielectric stack.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
J.L. Autran, D. Munteanu, M. Bescond, M. Houssa, A. Said,