| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10364972 | Microelectronics Reliability | 2005 | 8 Pages |
Abstract
The experimental results show that higher IR-reflow peak temperature induced voids forming in the solder joints and then failure mode change from interface between intermetallic and solder to cracks cut across the big voids during TCT test, worse TCT reliability performance ensued. Moreover, according to on-board reliability testing data show that the compound with larger package warpage change generated larger cumulate plastic work in solder joint that caused early failure during TCT process.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee,