Article ID Journal Published Year Pages File Type
10365170 Microelectronics Journal 2005 5 Pages PDF
Abstract
The reliability and integrity of HfO2 prepared by direct sputtering of hafnium were studied. By monitoring the current-voltage and current-stressing duration characteristics, we found a significant charge trapping effect in thin film with very short stressing time (<30 s) but the stress-induced trap generation is insignificant. The breakdown characteristics of hafnium gate oxide were also investigated in detail. We found that several soft breakdowns take place before a hard breakdown. Area and stress-voltage effects of the time-dependent dielectric breakdown were observed. Results suggest that the soft and hard breakdowns should have different precursor defects. A two-layer breakdown model of is proposed to explain these observations.
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Physical Sciences and Engineering Computer Science Hardware and Architecture
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