Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10365327 | Microelectronics Reliability | 2005 | 9 Pages |
Abstract
CDM hardening during the development of technology, devices, libraries and finally products differs significantly from the process well-established for HBM. This paper introduces a method on the basis of specialized CDM test structures including protection elements and sensitive monitor elements. These test structures mimic typical CDM-sensitive circuits found by physical failure analysis over the years. Manufactured in five different technologies, structures were assembled in both a regular package and a new package emulator. CDM stress tests, very-fast TLP tests, transient interferometric mapping, device simulation, and failure analysis lead to new insights in the complex interdependencies during CDM and underline the need of CDM-specific test structures.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
W. Stadler, K. Esmark, K. Reynders, M. Zubeidat, M. Graf, W. Wilkening, J. Willemen, N. Qu, S. Mettler, M. Etherton, D. Nuernbergk, H. Wolf, H. Gieser, W. Soppa, V. De Heyn, M. Natarajan, G. Groeseneken, E. Morena, M. Frank,