| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10365708 | Microelectronics Reliability | 2014 | 7 Pages |
Abstract
- The reliability properties of solderable ICA interconnections were investigated.
- The metallurgically-interconnected solderable ICA show good electrical reliability.
- The interfacial IMC layers were transformed from scallop-type to layer-type IMC.
- The fracture surface showed a semi-brittle fracture mode.
- Solderable ICA can achieve excellent electrical/mechanical reliability properties.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Young-Eui Shin, Jong-Min Kim,