| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10365728 | Microelectronics Reliability | 2014 | 11 Pages |
Abstract
Mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics were successfully investigated. The experimental results showed that composite solder joints exhibited higher hardness and shear strength as compared to the plain Sn-Ag-Cu solder joints. In addition, composite solder containing ZrO2 nano-particles exhibited lower damping capacity as compared with plain Sn-Ag-Cu solder due to fine microstructure and uniformly distributed ZrO2 nano-particles which increase the dislocation density.
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Authors
Asit Kumar Gain, Y.C. Chan,