Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10569242 | Journal of Power Sources | 2011 | 7 Pages |
Abstract
⺠For the spinel coatings generated using smaller voltage than 400 V, the interconnect surfaces exhibit good packing behavior and high conductivity. ⺠The reduced atmosphere during sintering has a beneficial impact on the minimizing chromia subscale formation and thus reducing the area specific resistance (ASR) of the coated interconnects. ⺠A more stable long-term performance is achieved for the spinel coating sintered in H2/H2O atmosphere with thin chromia sub-scale and no Cr penetration. ⺠Based on the current results, EPD followed by reduced-atmosphere sintering is a fast and economic way to deposit (Mn,Co)3O4 coating for SOFC interconnect applications.
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Authors
Hui Zhang, Zhaolin Zhan, Xingbo Liu,