Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
11016467 | Microelectronics Reliability | 2018 | 4 Pages |
Abstract
Integrated circuit (IC) reliability failure at field presents significant cost to both manufacturer and consumer. This paper targets reliability issue due to IC design weakness, presenting a case of 28â¯nm Input/Output (I/O) circuit reliability failure, and shows a complete work flow, starting from root cause identification using Final Test (FT) and failure analysis (FA), and ending with design retrofit to solve the issue. The work flow solves a 28â¯nm I/O reliability issue successfully (a narrow metal leads to EOS at field, and design retrofit is done to enlarge metal's current carrying capability). The work flow is applicable to solve general design related reliability problems.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Yi Chao Low, P.K. Tan, S.L. Tan, Y.Z. Zhao, J. Lam,