Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation

The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electronic components. Micro milling - and laser-decapsulation in combination with plasma etching were chosen as preparation methods. Raman spectroscopy has been applied as well as the piezo resistive read out on a specifically designed model stress monitoring chip. The results of the analysis at each manufacturing step of the model chip and the first investigations of partial decapsulation are presented.