Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering

This work introduces a method called reballing that will produce 300 microns beads from 25 to 45 microns balls. The proposed process is based on the use of a reballing stencil. We analyse the influence of the temperature descent curve during welding, and explore its effects on the final weld's quality. Finally, we will verify the compliance of our low-cost (less than €40), low temperature (138 °C), curve-optimised reworking process on micro-BGA components.