| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971438 | Microelectronics Reliability | 2017 | 8 Pages |
Abstract
Proposed methodology of equivalent sag stiffness reduces area measure of bond wire.79
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Huang-Kuang Kung, Chi-Lung Hsieh,