| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971468 | Microelectronics Reliability | 2017 | 8 Pages |
Abstract
It can be concluded that the proposed fatigue test method is a powerful alternative screening method for such miniaturized bond interfaces, which allows to reveal their mechanical fatigue behavior in reasonable time and to identify the weakest link of the tested bond interface.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
A. Lassnig, M. Lederer, G. Khatibi, R. Pelzer, W. Robl, M. Nelhiebel,