| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971483 | Microelectronics Reliability | 2017 | 6 Pages |
Abstract
The article presents the results of transient thermal measurements of a coil integrated in a silicon chip. Based on those measurements and using numerical procedures, thermal impedance, time constant distribution and structure functions were obtained. Next, using simple physical models of heat transfer phenomena, the 3 major time constants of the device under test were calculated, compared with measurement results and explained physically.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M. KaÅuża, B. WiÄcek, G. De Mey, A. Hatzopoulos, V. Chatziathanasiou,