| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971485 | Microelectronics Reliability | 2017 | 7 Pages |
Abstract
The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Mingna Wang, Jianqiu Wang, Wei Ke,