| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 4971495 | Microelectronics Reliability | 2017 | 5 Pages | 
Abstract
												The impact of sense measurement duration on BTI degradation in MG/HK devices is assessed by adapting a novel stacked transistor test structure in combination with a multiple drain current sensing scheme in the μs and ms time range. For NBTI, a fast de-trapping component causes dispersion in the DC time evolution for the different sense measurement duration but only at short stress times. However, at long stress times, relevant for lifetime projections, the impact diminishes. For PBTI and AC stress, the sense measurement duration is not a contributing factor. For technology qualifications where prolonged stresses are exercised, sense duration in the μs and ms time range yield equivalent model parameters.
											Related Topics
												
													Physical Sciences and Engineering
													Computer Science
													Hardware and Architecture
												
											Authors
												Andreas Kerber, 
											