Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971501 | Microelectronics Reliability | 2017 | 10 Pages |
Abstract
Hydrogen migration in a SiO2/Si system is examined in detail by nuclear reaction analysis. Electrical reliability measurements reveal a correlation between hydrogen migration from the cathode interface to the SiO2/Si interface and dynamic degradation of the gate dielectric. In addition, the defect levels generated in the bulk of SiO2 have an energy distribution corresponding to that of oxygen vacancies, as revealed by comparing the measured and simulated stress-induced leakage current. Finally, a model of hydrogen-induced gate dielectric degradation is proposed based on first-principles calculations.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Yusuke Higashi, Riichiro Takaishi, Koichi Kato, Masamichi Suzuki, Yasushi Nakasaki, Mitsuhiro Tomita, Yuichiro Mitani, Masuaki Matsumoto, Shohei Ogura, Katsuyuki Fukutani, Kikuo Yamabe,