| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971564 | Microelectronics Reliability | 2017 | 7 Pages |
Abstract
Simulation analysis can give, using the appropriate software, depending on the material properties, the package geometry as well as the boundaries, a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal, electrical and mechanical behavior of the package.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Kirsten Weide-Zaage,