| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971629 | Microelectronics Reliability | 2017 | 5 Pages |
Abstract
Reliability of electronics is mostly driven by the reliability of lead free solder alloys since the replacement of hazardous materials by RoHS directive. This study aims to combine experiments and finite elements modelling in order to get prepared for fatigue characterisation of complex soldering assemblies. It consists, at first, to identify creep coefficients from experiments and implement them into a numerical model. The model is used to discuss some discrepancies of the results and simulating thermal cycling tests. In a second step, the microstructure of aged specimens is correlated to numerical observations to help finding a proper failure scenario.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
S. Pin, H. Frémont, A. Guédon-Gracia,