Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971632 | Microelectronics Reliability | 2017 | 7 Pages |
Abstract
As an indicator of degradation, the oxidation of the Cu surface was used. It could be shown that a C layer provides a much better protective effect than a Pt layer. Besides very local sporadically distributed Cu oxide grains, a gradual degradation of the protective carbon film was not even observable at the nanoscale for a stress temperature of 200 °C and layer thicknesses down to 3 nm. In contrast, with a 10 nm thick Pt film the Cu surface exhibits already at a stress temperature of 150 °C locally grown Cu oxide grains. The introduced carbon coating passivation of Cu surfaces has the potential of being a key technique for a reliable Cu-Cu wire bonding.
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Authors
Tobias Berthold, Guenther Benstetter, Werner Frammelsberger, Manuel Bogner, Rosana RodrÃguez, Montserrat NafrÃa,