| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971637 | Microelectronics Reliability | 2017 | 6 Pages |
Abstract
During the last years applications for power modules with harsh environmental conditions have gained increasing importance. Extreme combinations of environmental conditions especially at weak load conditions have to be understood to avoid risks induced by humidity condensation. The present work investigates the influence of different cycling profiles on condensation phenomena. The phase within the cycling profile that is liable for condensation can be identified and the risk for long term build-up of humidity inside a package is studied in outdoor measurements.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
S. Kremp, O. Schilling,