Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971641 | Microelectronics Reliability | 2017 | 7 Pages |
Abstract
In this paper, authors developed an innovative packaging for a power inverter SiC MOSFET-Schottky. The design, composed by 6 SiC-MOSFET and 6 SiC-Schottky diodes, places dice between 2 direct-bonding-copper substrates, it was optimized to equilibrate thermal repartition on the two DBC surfaces. We purpose to increase thermal dissipation of power modules by the use of two water-cooling blocks disposed on top and on the bottom of our power inverter; it permits to use both sides of power module to dissipate heat flux. According to Finite Element Method simulations performed with ANSYS®, double side cooling permits to enhance by up to two times thermal dissipation. Moreover solders are replaced by silver sintering and wire-bonds are suppressed by top substrate connections. We want to highlight that those improvements participates to increase reliability of power modules.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M. Barrière, A. Guédon-Gracia, E. Woirgard, S. Bontemps, F. Le Henaff,