Article ID Journal Published Year Pages File Type
4971657 Microelectronics Reliability 2017 5 Pages PDF
Abstract
We propose a new pattern for the clamp-type PCB sensor and fabricate the PCB sensor as a built-in sensor in a power module. With the new pattern, it is possible to move and widen the gap for clamping. The signal error is small even though the sensor is inclinedly attached to the bonding wire. The accuracy is confirmed by a comparison between the clamp-type PCB sensor in the module and a commercially available current sensor outside the module. The clamp-type PCB sensor can be applied for intelligent power modules as well as current measurement for power electronic converters.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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