Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971657 | Microelectronics Reliability | 2017 | 5 Pages |
Abstract
We propose a new pattern for the clamp-type PCB sensor and fabricate the PCB sensor as a built-in sensor in a power module. With the new pattern, it is possible to move and widen the gap for clamping. The signal error is small even though the sensor is inclinedly attached to the bonding wire. The accuracy is confirmed by a comparison between the clamp-type PCB sensor in the module and a commercially available current sensor outside the module. The clamp-type PCB sensor can be applied for intelligent power modules as well as current measurement for power electronic converters.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
M. Tsukuda, K. Nakashima, S. Tabata, K. Hasegawa, I. Omura,