Article ID Journal Published Year Pages File Type
4971772 Microelectronics Reliability 2016 6 Pages PDF
Abstract
However, the experiments carried out for a natural convection cooled power device with a heat sink showed that the temperature dependence of the heat transfer coefficient results in the appearance of a characteristic hump in this curve. A simple analytical model was developed here to predict the location of this extremum. The analyses presented in this paper are valid when the thermal time constant reflecting the thermal capacitance of a heat sink and the heat exchange with ambient is dominant.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
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