Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4971777 | Microelectronics Reliability | 2016 | 10 Pages |
Abstract
Further, for minimizing the expensive meshing of the finely detailed simulations and the computation time, a novel concept of compact thermal model for inductor device, based on DELPHI methodology, was used. The deducted two-heating-source DELPHI-style model adequately correlates the physical behaviour of all heat paths of the inductor device, our purpose.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Eric Monier-Vinard, Brice Rogié, Cheikh Tidiane Dia, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Marie-Cécile Kotelon, Aben-Ibrahim Fahad,