Article ID Journal Published Year Pages File Type
4971777 Microelectronics Reliability 2016 10 Pages PDF
Abstract
Further, for minimizing the expensive meshing of the finely detailed simulations and the computation time, a novel concept of compact thermal model for inductor device, based on DELPHI methodology, was used. The deducted two-heating-source DELPHI-style model adequately correlates the physical behaviour of all heat paths of the inductor device, our purpose.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
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