| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971785 | Microelectronics Reliability | 2016 | 9 Pages |
Abstract
A major achievement is the comprehensive and detailed demonstration of the proposed reliability qualification approach. Case studies on qualifying electronic components to the thermal loads induced by a particular post-manufacturing process widely adopted by high-reliability electronics sectors - the robotic hot solder dip (refinishing) process, and associated risks of thermo-mechanical damage are presented and discussed.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis,