| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4971845 | Microelectronics Reliability | 2016 | 7 Pages |
Abstract
The developed so called highly robust metallization is optimized for applications with extended operating conditions regarding higher currents and temperatures as well as mechanical stress [4]. Donut-Vias are elements of the highly robust metallization for the interconnection of highly robust metal lines. The paper shows the layout of a Donut-Via and explains the benefits and limits of the new layout by simulation and test results.
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Authors
Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai,